3D IC Cooling

There is an important need to propose an essential cooling system for the advanced semiconductor technology, especially in the 2.5D and 3D stack fashions, which are the most common. This type of architecture consists of tiers of ICs in a three-dimensional format, where each IC sits on top of another. The product is capable of presenting a high level of performance and computational power if it is equipped with an efficient cooling system.

The importance of a well-engineered, efficient, and cost-effective cooling system cannot be overstated, as not having one with minor innovation will jeopardize the design and increase the chances of failure in an IC when it is run in use cases by customers. It is important to note that a weak cooling solution can potentially result in a reduction of performance and power consumption of the product. As a result of leveraging modern cooling technologies such as an allegedly designed liquid cooling or hybrid cooling circuit, it would be possible to guarantee the longer lifespan of the introduced product as well as its high performance capabilities.

A Few Good Reads (Blogs)

https://www.mdpi.com/1996-1073/15/13/4566

https://resources.system-analysis.cadence.com/blog/msa2022-the-importance-of-thermal-management-in-electric-vehicles

https://www.mikrostechnologies.com/home/applications/semiconductors/#:~:text=When%20a%20semiconductor%20device%20or,of%20electronic%20components%20under%20control.

Thank you for reading. Staying tuned for the next article published by Pouya Asrar!