Selecting the Right Thermal Pad/Paste in Electronics Cooling

An electronic component’s thermal pad plays a significant role in its performance. Choosing the right pad thickness is crucial in order to ensure an electronic component presented to the customer is well-cooled so that the heat can be dissipated to the surrounding area to the maximum extent possible.

The market offers a wide range of thermal pads in a number of different materials. In order to use these silicon based products, one can use graphite, polyimide, or silicone based pads. The thermal conductivity and cooling characteristics of pads and pastes can vary based on the material that you choose, as well as the surface treatment. In terms of thermal conductivity, Silicone pads are usually lower in comparison with Graphite pads, but they are better at bridging gaps quicker and easier than graphite pads. There is a need to analyze what electronics application this thermal pad or paste will be used for in order to provide the best durability for the thermal pad/paste. In addition, the operating temperature range of a thermal pad can directly affect how well it performs when it comes to responding to temperature. Accordingly, it is recommended that you pay close attention to the allowable and alleged operating temperatures of the thermal pad in order to increase its heat removal capacity as well as to minimize the effect on its durability.

It is common practice for thermal pastes to be made of a base or filler material, which is then mixed with conductive metal oxide or carbon-based materials. Silicone can be used as the base material of the compound, which is an extremely stable material that enhances the stability of the entire mixture. By choosing the right material, it will ensure that the hot component will have a better thermal conductivity when attached to the material, and that the temperature will be maintained within an acceptable range in order to prevent the component from overheating.